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Standard resistor/capacitor 3220 chip SMD package

DSC1123CI2 Low-Jitter Precision LVDS Oscillator DSC1103 DSC1123

DSC1103 DSC1123 MicrelPackage for LVDS Oscillator DSC1123. DFN-6, 6 pin package. Package size 3.2mm x 2.5mm.http://ww1.microchip.com/downloads/en/DeviceDoc/DSC1103%20DSC1123%20Datasheet%20MKQBPD11041003-6.pdf

ON Semiconductor

Package for ON Semiconductor ESD7008 ESD Protection diodes. UDFN-18, body size 5.5x1.5mm.http://www.onsemi.com/pub_link/Collateral/ESD7008-D.PDF

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ONSemi

Dual MOSFET. 0.9 x 0.65 x 0.44. XLLGA6.

Telit

11mm x 11mm x 6.1mm 32-Pin QFN GPS Module

SMD transformer, TDK Type ACM7060

NXP

Low voltage comparator. 1 x 1.45 x 0.5mm. SOT886, XSON6.

Quectel

M66 is currently the smallest Quad-band GSM/GPRS module using LCC castellation packaging on the market. Based on the latest 2G chipset, it has the optimal performance in SMS & Data transmission and audio service even in harsh environment. Its ultra-compact 15.8 × 17.7 × 2.3mm profile makes M66 a perfect platform for size sensitive applications.

Quectel

Module packaging 15.8 × 17.7 × 2.3mm